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Title:
SEQUENTIAL FORMING APPARATUS
Document Type and Number:
Japanese Patent JP2010149137
Kind Code:
A
Abstract:

To provide a sequential forming apparatus which is the one for forming a thin metal plate, wherein the thin metal plate is formed in a short time without any shrinkage at a corner part of large deformation, the cost is reduced, and the structure is simple and energy required for the forming is reduced.

In the sequential forming apparatus 1, a blank 30 is set on an upper surface of a lower die 10 having a forming die part 11, and the blank is pressed against the upper surface of the lower die by a clamper 2. Oil filled in an oil pool 6 formed of the blank and the forming die part is sucked by a decompression pump 4 via a piping system 20, the pressure in the oil pool is reduced to execute the decompression forming of the entire blank, and the upper surface of the blank is pressed by a bar tool 2 so as to follow the contour of the forming die for perform the sequential forming, and the blank is formed in a predetermined shape.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
SUZUKI TOMOHISA
YAMADA AKIRA
Application Number:
JP2008328903A
Publication Date:
July 08, 2010
Filing Date:
December 25, 2008
Export Citation:
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Assignee:
AISIN SEIKI
International Classes:
B21D22/18; B21D22/06
Domestic Patent References:
JP2004058139A2004-02-26
JP2003236627A2003-08-26
JP2003245728A2003-09-02
JPS6477515A1989-03-23
JP2006341262A2006-12-21
JP2008149462A2008-07-03
JP2002001444A2002-01-08