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Title:
SET-LAYING FLOOR MATERIAL
Document Type and Number:
Japanese Patent JPH03169967
Kind Code:
A
Abstract:

PURPOSE: To prevent the crack of a base material by imparting bending flexibility thereto and to easily and rapidly perform connection by laminating a thin wooden decorative panel to the surface of the base material having a fitting protruding part and a fitting recessed part either one of which is provided with a come-off preventing projection formed to both side ends thereof.

CONSTITUTION: A wooden decorative panel 2 having grain formed by thinly slicing wood is laminated to the surface of a flexible sheet like base material made of a synthetic resin having a fitting protruding part 3, which has a draw- out preventing projection 3a formed thereto, and a fitting recessed part 4 respectively formed to both side ends thereof to constitute a set-laying floor material A. A coming-off preventing projection may be formed to the fitting recssed part 4. By this method, the warpage of the base material 1 is eliminated and flexibility is imparted and the compatibility with the ground under a floor is improved and the propagation of vibration is suppressed to also enhance soundproofness and the preparation of a connection part is made easy. Further, the floor material A is easily and rapidly laid only by engaging the connection part.


Inventors:
HAYASHI MORIO
YAMAZAKI KIYOYOSHI
MINEGISHI YASUYUKI
Application Number:
JP30691189A
Publication Date:
July 23, 1991
Filing Date:
November 27, 1989
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
E04F15/02; E04F15/04; E04F15/10; E04F15/16; (IPC1-7): E04F15/02; E04F15/04; E04F15/16
Attorney, Agent or Firm:
Ishida Chochichi (2 outside)