To obtain a setting organic resin composition comprising a setting organic resin and silicon atom-containing compound obtained by binding a specific group with the silicon atom, and capable of forming a setting resin excellent in fluidity before setting and superior in cohesion and adhesion properties after setting.
This composition comprises at least (A) 100 pts.wt. of setting resin (pref. an epoxy resin, imide resin or phenol resin), and (B) 0.01 to 100 pts.wt. of silicon atom-containing compound obtained by binding a group of formula I [R1 is H, a (substituted) univalent hydrocarbon or silyl; and R2 is a ≥2C (substituted) alkylene] with the silicon atom, wherein the compound is pref. shown by formula II [R3 is H, a (substituted) univalent hydrocarbon or alkoxy; and (a) and (b) satisfy the equations of 0<a≤1, 1≤b≤2, and 3<2a+b≤4].
UEKI HIROSHI
FURUKAWA HARUHIKO
IWAI AKIRA
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