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Patent Searching and Data


Title:
SETTING ORGANIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2000086904
Kind Code:
A
Abstract:

To obtain a setting organic resin composition comprising a setting organic resin and silicon atom-containing compound obtained by binding a specific group with the silicon atom, and capable of forming a setting resin excellent in fluidity before setting and superior in cohesion and adhesion properties after setting.

This composition comprises at least (A) 100 pts.wt. of setting resin (pref. an epoxy resin, imide resin or phenol resin), and (B) 0.01 to 100 pts.wt. of silicon atom-containing compound obtained by binding a group of formula I [R1 is H, a (substituted) univalent hydrocarbon or silyl; and R2 is a ≥2C (substituted) alkylene] with the silicon atom, wherein the compound is pref. shown by formula II [R3 is H, a (substituted) univalent hydrocarbon or alkoxy; and (a) and (b) satisfy the equations of 0<a≤1, 1≤b≤2, and 3<2a+b≤4].


Inventors:
MORITA YOSHIJI
UEKI HIROSHI
FURUKAWA HARUHIKO
IWAI AKIRA
Application Number:
JP25588998A
Publication Date:
March 28, 2000
Filing Date:
September 10, 1998
Export Citation:
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Assignee:
DOW CORNING TORAY SILICONE
International Classes:
C08K5/54; C08L35/00; C08L61/06; C08L63/00; C08L83/14; C08L101/00; (IPC1-7): C08L101/00; C08K5/54; C08L35/00; C08L61/06; C08L63/00; C08L83/14