Title:
SHAPE MEASUREMENT APPARATUS AND SHAPE MEASUREMENT METHOD
Document Type and Number:
Japanese Patent JP2006258516
Kind Code:
A
Abstract:
To provide a shape measurement method and its apparatus allowing to easily correlate a two-dimensional or three-dimensional shape with shape indicators.
A curve equation is fitted to the three-dimensional shape of a semiconductor pattern measured by an arbitrary three-dimensional shape measurement method. The three-dimensional shape is corrected by adjusting the parameters of the curve equation on the basis of the shape indicators calculated separately. The relationship between the shape indicators and the parameters are stored in a database, and the measured shape is corrected on the basis of the relationship during measurement.
Inventors:
MIYAMOTO ATSUSHI
TANAKA MAKI
MOROKUMA HIDETOSHI
TANAKA MAKI
MOROKUMA HIDETOSHI
Application Number:
JP2005074249A
Publication Date:
September 28, 2006
Filing Date:
March 16, 2005
Export Citation:
Assignee:
HITACHI HIGH TECH CORP
International Classes:
G01N23/203; G01B15/04; G01N23/225
Attorney, Agent or Firm:
Manabu Inoue
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