To measure a solder paste bump with high accuracy up to a stereoscopic shape including its height.
First and second slit light sources 31, 32 are arranged over a printed circuit board 10, and radiate a pair of slit light approximately in parallel from both sides on oblique upside toward the solder paste bump formed on the upper surface of the printed circuit board 10. A camera 33 is also provided over the printed circuit board 10, and images the solder paste bump. A stage 20 on which the printed circuit board 10 is placed is driven by a slide actuator 21, and the upper face of the solder paste bump is scanned by the slit light. Image data for showing a scanning image of the slit light by the camera 33 are transferred successively to a computer body part 41. The computer body part 41 measures the shape of the solder paste bump by image processing following an optical cutting method by using a plurality of pairs of the image data transferred successively.
SHIOMI TOSHIO
FUJIMOTO AKIO
Shinji Kato