Title:
賦形装置および賦形方法
Document Type and Number:
Japanese Patent JP7310027
Kind Code:
B2
Abstract:
A forming device includes: a forming jig extending along an axial direction; a forming die having a shape corresponding to a top part region and a wall part region of the forming jig; and a movement mechanism that moves the forming die so as to approach a bottom part region along a height direction HD. The forming die includes: a body part; a plate-shaped forming part that is attached to the body part so as to be swingable around a swing shaft; and a pressurization part that generates a pressurization force which causes a distal end part of the forming part to push a layered body against the wall part region when the forming die is moved by the movement mechanism so as to approach the bottom part region. In accordance with the distal end part, the part causes a contact surface to contact a region of the layered body.
Inventors:
Yamato Homare
Masahiko Shimizu
Shoya Shinno
Toshiki Kitazawa
Hideki Horisono
Masahiko Shimizu
Shoya Shinno
Toshiki Kitazawa
Hideki Horisono
Application Number:
JP2022539955A
Publication Date:
July 18, 2023
Filing Date:
July 31, 2020
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
B29C70/54; B29C43/34; B29C70/34
Domestic Patent References:
| JP2017030329A | ||||
| JP2007260925A |
Attorney, Agent or Firm:
Takaharu Fujita
Takaori Mitoma
Miki Kawakami
Daisuke Nagata
Takaori Mitoma
Miki Kawakami
Daisuke Nagata