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Title:
SHEARING METHOD AND SHEARING DEVICE
Document Type and Number:
Japanese Patent JP2009241245
Kind Code:
A
Abstract:

To simultaneously perform outer shape machining, contour machining and boring machining for a substrate to be a workpiece with a low load and high accuracy using a compact and low-noise machining device.

A workpiece is subjected to shearing with applying a vibration having a large amplitude obtained by amplifying a vibration having a small amplitude to enable outer shape machining, contour machining and boring machining of the workpiece simultaneously to be accurately and simultaneously performed with a low load by keeping the workpiece at an optimum temperature, with thereby accelerating reduction in the size of a machining device and noises. Furthermore, since the temperature of the workpiece can be optimally maintained by alternately performing a vibration motion 22 and a pressing motion 21, the outer shape machining, the contour machining and the boring machining for the workpiece can be highly accurately performed simultaneously with the low load.


Inventors:
FUJIOKA TOSHIYUKI
KATAYAMA AKINOBU
INADA MAKOTO
HATTORI YOHEI
HATANAKA YOICHI
GOTO MASAYUKI
MORIKAWA HIROKI
Application Number:
JP2008094434A
Publication Date:
October 22, 2009
Filing Date:
April 01, 2008
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
B26D7/08
Domestic Patent References:
JPH0516198U1993-03-02
JPS63251196A1988-10-18
JPS61241100A1986-10-27
JPH07195298A1995-08-01
JPH0516198U1993-03-02
Attorney, Agent or Firm:
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada