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Title:
SHEET ADHERING DEVICE AND SHEET ADHERING METHOD
Document Type and Number:
Japanese Patent JP2014017307
Kind Code:
A
Abstract:

To provide a sheet adhering device capable of easily supplying a ring frame.

A sheet adhering device 1 comprises: frame housing means 3 capable of housing plural ring frames RF integrated with a wafer WF via an adhesive sheet AS; support means 7 for supporting at least the ring frame RF out of the ring frame RF and the wafer WF; transfer means 8 for picking up the ring frame RF from the frame housing means 3 and transferring it to the support means 7; and adhesion means 9 for adhering the adhesive sheet AS into contact with the ring frame RF or the ring frame RF and the wafer WF supported by the support means 7. The frame housing means 3 is constituted to house the ring frame RF vertically.


Inventors:
YAMAGUCHI KAZUTOSHI
KATO HIDEAKI
Application Number:
JP2012152242A
Publication Date:
January 30, 2014
Filing Date:
July 06, 2012
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
H01L21/677; H01L21/683
Domestic Patent References:
JPH0228347A1990-01-30
JPH0697267A1994-04-08
JPH11278742A1999-10-12
JP2002128287A2002-05-09
JP2011026010A2011-02-10
JP2001017752A2001-01-23
Attorney, Agent or Firm:
Intellectual Property Office