Title:
SHEET ADHESION DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2015191933
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sheet adhesion device that can make an adhesive sheet adhere to an adherend without applying stress to the adherend, and make the outer edge of the adhesive sheet to surely adhere to the adherend.SOLUTION: A sheet adhesion device 10 has press means 30 for pressing an adhesive sheet AS to an adhesion target surface WF1 of a wafer WF, and moving means 40 for relatively moving the wafer WF and the press means 30 to make the adhesive sheet AS attached to the wafer WF. The moving means 40 can perform a linear relative movement of relatively moving the wafer WF and the press means 30 in a predetermined linear direction and a circumferential relative movement of relatively moving the wafer WF and the press means 30 along the outer edge of the adhesive sheet AS. The press means 30 can perform whole surface press of the adhesive sheet AS in which the whole area from one end to the other end of the adhesive sheet AS perpendicular to the linear direction is pressed against the adhesion target surface WF1 and the linear relative movement is made, and partial press of the adhesive sheet AS in which only the outer edge portion of the adhesive sheet AS is pressed against the adhesion target surface WF1, and the circumferential relative movement is made.
Inventors:
SUGISHITA YOSHIAKI
Application Number:
JP2014066212A
Publication Date:
November 02, 2015
Filing Date:
March 27, 2014
Export Citation:
Assignee:
LINTEC CORP
International Classes:
H01L21/683
Domestic Patent References:
| JP2011210854A | 2011-10-20 | |||
| JP2003197723A | 2003-07-11 | |||
| JP2013230532A | 2013-11-14 | |||
| JPH09148282A | 1997-06-06 | |||
| JP2006032678A | 2006-02-02 | |||
| JP2012209303A | 2012-10-25 | |||
| JP2013235635A | 2013-11-21 | |||
| JP3184740U | 2013-07-11 | |||
| JP2011210855A | 2011-10-20 |
Attorney, Agent or Firm:
Intellectual Property Office