To obtain a sheet adhesive composition capable of repairing an electronic part device without discarding it even if contact failure is caused by the deviation of the positions of electrodes and the like, for example, when used in the electrical contact between the opposite electrodes of an electronic part device.

This sheet adhesive composition is obtained by laminating a first layer 1 composed of a thermoplastic resin composition comprising (A) a polyhydroxy polyether resin as the major component and a third layer 4 composed of a thermoplastic resin composition comprising (A) the polyhydroxy polyether resin as the major component on both sides of a second layer 2 composed of a thermosetting resin composition comprising (B) a synthetic rubber, (C) an epoxy resin, and (D) a curing agent as the major components, respectively.