Title:
SHEET FOR DRILLING PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING DRILLED PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2005153103
Kind Code:
A
Abstract:
To obtain a high quality printed wiring board with less burrs due to drilling work, small roughness in the inner wall of a hole, and high accuracy in a hole position in a process of drilling a hole with such a small diameter as in 0.050-0.15 mm in manufacturing the printed wiring board.
This sheet for drilling work in the printed wiring board is made of resin layers with a higher elastic modulus in the drill entry side than in the outlet side. Those resin layers are composed of a multi-layer structure with at least three or more layers combined by an adhesive to which a lubricant is added.
Inventors:
Oyama, Yasushi
Sakuma, Kazunori
Inoue, Atsushi
Nemoto, Tetsushi
Sakuma, Kazunori
Inoue, Atsushi
Nemoto, Tetsushi
Application Number:
JP2003000397362
Publication Date:
June 16, 2005
Filing Date:
November 27, 2003
Export Citation:
Assignee:
HITACHI CHEM CO LTD
International Classes:
B23B41/00; B23B49/00; H05K3/00; B23B41/00; B23B49/00; H05K3/00; (IPC1-7): B23B41/00; B23B49/00; H05K3/00
