To realize the low heat resistance connection of a sheet to be used for the thermal and electrical connection or the like between an electronic part and a heat sink for cooling the electronic part by forming the sheet equipped with an embossed soft metal layer and a rubber layer, which covers one side or both the sides of the soft metal layer.
When a heat sink is mounted to a part (a part to be cooled) such as a semiconductor element or the like to be cooled, a sheet consisting of an embossed soft metal layer and a rubber layer, which is provided on one side or both the sides of the soft metal layer is arranged between the heat sink and the part to be cooled. The soft metal layer to be used has preferably a tensile strength of 100 N/mm2 or less. As the soft metal layer, an aluminum material or a copper material is preferable. Especially, when an electrical connection is required, the rubber layer is made of a rubber having the consistency of 30° or more. Further, the rubber layer is made of a rubber composition containing a heat conductive filler containing either one selected from the group consisting of a metal powder, a metal nitride, a metal oxide, a silicone carbide or the like.
KIMURA NAOKI
NIEKAWA JUN
KAWASHIMA HIROYUKI
Next Patent: PRODUCTION OF LAMINATED SHEET