Title:
SHEET FOR HEAT CONDUCTION
Document Type and Number:
Japanese Patent JPS63186878
Kind Code:
A
Abstract:
PURPOSE: To produce a sheet having improved heat conductivity and corrosion resistance, by plating the surface of an In sheet with Au or Au/Ni.
CONSTITUTION: The surface of an In sheet is plated with Au or Au/Ni by electroless plating to about 2μm thickness to obtain an In sheet for heat conduction having improved heat conductivity and corrosion resistance without deteriorating the flexibility. The obtd. sheet is suitable for use as a sheet for cooling a semiconductor element.
Inventors:
HORIKOSHI EIJI
IIKAWA TSUTOMU
TAKEUCHI MUNETAKA
IIKAWA TSUTOMU
TAKEUCHI MUNETAKA
Application Number:
JP1672887A
Publication Date:
August 02, 1988
Filing Date:
January 27, 1987
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
C23C18/42; C23C30/00; H01L23/373; (IPC1-7): C23C18/42; C23C30/00; H01L23/36
Attorney, Agent or Firm:
Sadaichi Igita