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Title:
シート状熱硬化性樹脂組成物、並びにそれを用いた樹脂シート、モジュール部品、パワーデバイス及びコイル部品
Document Type and Number:
Japanese Patent JP6748967
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a sheet-like thermosetting resin composition that achieves both high thermal conductivity and high magnetic permeability in addition to high heat resistance, and various components prepared therewith.SOLUTION: A sheet-like thermosetting resin composition contains (A) a thermosetting resin having an imide skeleton in the molecule, and an allyl group as a functional group, (B) a maleimide compound, (C) an organic solvent, and (D) an inorganic filler. The amount of the (C) organic solvent volatilized is 0.85-1.5 mass%, relative to the sheet-like thermosetting resin composition, and the content of the (D) inorganic filler is 80 mass% or more relative to the sheet-like thermosetting resin composition.SELECTED DRAWING: None

Inventors:
Baba Daizo
Junichi Takashiro
Tachibana Takushi
Application Number:
JP2016232056A
Publication Date:
September 02, 2020
Filing Date:
November 30, 2016
Export Citation:
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Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
C08L35/00; C08K3/01; H01L23/12; H01L23/14; H01L23/36
Domestic Patent References:
JP2013127022A
JP2007231125A
JP2011231196A
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Otani
Usami Aya