To provide a sheet for tentatively fixing a component such as a small module component or the like that has tackiness at an ordinary temperature so as to tentatively fix the component and is released from the component after subjecting the component to high temperature treatment for soldering in a mounting process or the like and then cooling down to an ordinary temperature.

The sheet for tentatively fixing the component is provided with a composition comprising (A) a resin having tackiness at an ordinary temperature and (B) a wax. The sheet is formed by impregnating (C) a core material made of a knitted fabric and/or a nonwoven fabric or the like with the composition.