Title:
薄板搬送方法と薄板加工装置
Document Type and Number:
Japanese Patent JP5110078
Kind Code:
B2
Abstract:
A thin-plate processing method performs a step of positioning a workpiece on a temporary placement table; a step of sucking, after the positioning, the workpiece by using holes that form at least a row of holes out of the rows of holes, which are formed in the temporary placement table, without sucking portions near two opposite sides of the workpiece; a step of pressing the workpiece by a plate of a conveyance device with the workpiece sucked; a step of discharging, after the pressing, from holes that form rows of holes in the plate; a step of sucking by using the plate; a step of conveying, after the suction by the plate, the workpiece to a processing table; and a step of holding, after the conveyance, the workpiece on the processing table at the two opposite sides of the workpiece. The thin-plate processing is performed with good processing quality maintained.
Inventors:
Nishihara Manabu
Toshikazu Murakoshi
Keiya Shiraishi
Nishihara saint
Keiji Harada
Junji Kubo
Toshikazu Murakoshi
Keiya Shiraishi
Nishihara saint
Keiji Harada
Junji Kubo
Application Number:
JP2009503907A
Publication Date:
December 26, 2012
Filing Date:
March 12, 2008
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
B28B13/04
Domestic Patent References:
| JPH0422850A | 1992-01-27 | |||
| JP2003291125A | 2003-10-14 | |||
| JP2001015380A | 2001-01-19 | |||
| JP2001257126A | 2001-09-21 | |||
| JP2004031489A | 2004-01-29 | |||
| JP2004276279A | 2004-10-07 |
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii
Daisuke Nagano
Kentaro Fujii