Title:
SHIELD FOR SPUTTERING DEVICE AND TREATMENT OF SURFACE OF THE SAME
Document Type and Number:
Japanese Patent JPH11236667
Kind Code:
A
Abstract:
To provide a method for treating the surface of an aluminum shield for a sputtering device, which is used to deposit a large quantity of particles sputtered out of a sputtering target of the sputtering device.
The surface of the shield is sand-blasted with an Al2O3 particle to have about 30-45 μm surface roughness and the surface roughness of the shield surface is further increased to about 135-150 μm to enable to deposit many particles sputtered from the target over the surface of the shield by spraying using hot spraying method to apply a coating layer 34 of aluminum having ≥99% purity over the surface 32 of the aluminum shield 30.
Inventors:
CHEM SHUI-JEE
YAN IUAN-JO
LEE CHAO-FAN
YAN IUAN-JO
LEE CHAO-FAN
Application Number:
JP3918098A
Publication Date:
August 31, 1999
Filing Date:
February 20, 1998
Export Citation:
Assignee:
TRACE STORAGE TECHNOL CORP
HOEIRU IND CORP LTD
HOEIRU IND CORP LTD
International Classes:
C23C14/00; C23C14/34; H01L21/203; (IPC1-7): C23C14/34; C23C14/00; H01L21/203
Attorney, Agent or Firm:
Tadahiko Ito (1 outside)
Previous Patent: FILM FORMING DEVICE AND PRODUCTION OF DIELECTRIC FILM
Next Patent: THIN FILM FORMING DEVICE AND VACUUM DEPOSITION DEVICE
Next Patent: THIN FILM FORMING DEVICE AND VACUUM DEPOSITION DEVICE