PURPOSE: To surely reduce the harmful interfering waves and execute the work easily and cheapen it an lighten the weight by connecting a conductive film with the lead for grounding or the contiguous grounding face of electronic parts.

CONSTITUTION: Leads 44b of an IC 44 extend out of the four sides of an insulating package 44a, and out of these, plural leads 44c are for grounding. A linear conductive connector 442 such as a soft copper line, connects the conductive film 441 with each lead 44c for grounding, respectively, and further it has a conductive connector 443, which connects the conductive film 441 with the grounding pattern on a circuit board 43 by soldering. Therefore, harmful interfering waves, which have entered into the IC 44, are reflected by the conductive film 441 or captured, but it is guided to the grounding face of the circuit board 43 by the conductive connectors 442 and 443, and the level of the interfering waves, which reach the elements inside the IC 44, is attenuated sharply. Hereby, the weight is lightened, and it becomes cheap, and also it becomes stable, and the interfering waves can be reduced.