Title:
SHIELDED CONSTRUCTION OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3853769
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a shielded construction of electronic component arranged in three-dimension which assures efficient exchange and inspection or the like of internal electronic component.
SOLUTION: A shield case 3 to form a shield space for electromagnetically shielding an electronic component 5 mounted on a printed circuit board 1 includes an aperture 3a at its upper surface. A shield case 23 for electromagnetically shielding an electronic component 15 arranged at the upper part of the electronic component 5 is formed to be freely mounted or dismounted to or from the shield case 3. The shield case 23 is mounted to the shield case 3 to cover the aperture 3a of the shield case 3 in view of forming one shield case for electromagnetically shielding the electronic components 5, 15 in cooperation with the shield case 3.
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Inventors:
Yoshihide Saida
Application Number:
JP2003306475A
Publication Date:
December 06, 2006
Filing Date:
August 29, 2003
Export Citation:
Assignee:
NEC Access Technica Co., Ltd.
International Classes:
H05K9/00; (IPC1-7): H05K9/00
Domestic Patent References:
| JP8107286A | ||||
| JP7162181A | ||||
| JP2000196278A | ||||
| JP3057992U | ||||
| JP2001339194A | ||||
| JP62124894U | ||||
| JP57152846U | ||||
| JP3083281Y2 | ||||
| JP10154890A |
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata
Ishibashi Masayuki
Masaaki Ogata
Ishibashi Masayuki