PURPOSE: To make it possible to connect simply a case to the reference potential part of a printed substrate using a plate spring and lead wires in a small-sized electronic apparatus by a method wherein a conductive layer consisting of a conductive coating material or a conductive bonding agent is provided partially on the conductive resin surface of the case and the case is connected to the reference potential part of the printed substrate through this conductive layer.

CONSTITUTION: A case 1 is a double molded article, whose outer and inner sides are respectively formed of an insulative resin and a conductive resin, and a case main body 2 and a case cover 3 are respectively formed of insulative and conductive resin parts 2a and 2b and insulative and conductive resin parts 3a and 3b. An electronic circuit element is mounted on a printed substrate 4 housed in the case 1 and an electric power and a signal are inputted through a code 11. A conductive layer 16 coated with a conductive coating material is provided on the conductive resin surface of the case main body 2, a phosphor bronze plate spring 18 soldered to a reference potential part 17 of the substrate 4 comes into contact to this part and the case 1 is connected electrically to the part 17 of the substrate 4.