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Patent Searching and Data


Title:
SHOE SOLE STRUCTURE WITHOUT REQUIRING POLISHING AND ADHESION BY ADHESIVE
Document Type and Number:
Japanese Patent JP2006075595
Kind Code:
A
Abstract:

To provide a shoe sole without requiring polishing and adhesion by an adhesive.

A shoe comprises a shoe body 10 with a plurality of members seamed together, a shoe insole 4 connected to the bottom part of the shoe body 10, a side sheet 2 which is wound around the bottom part of the shoe body 10 and has a plurality of holes 20, and a space part 21 between the bottom part of the shoe body 10 and the side sheet 2. A fused material of a shoe outer bottom 3 is injected into a metallic mold and is easily filled into the space part 21 and the holes 20 of the side sheet 2 to firmly connect the parts.


Inventors:
CHEN CHUANG-CHUAN
Application Number:
JP2005257211A
Publication Date:
March 23, 2006
Filing Date:
September 06, 2005
Export Citation:
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Assignee:
CHEN CHUANG-CHUAN
International Classes:
A43B9/16; B29D35/06
Attorney, Agent or Firm:
Shinichi Tamaki