Title:
BALL GRID ARRAY PACKAGE WITHOUT MUTUAL CONNECTION AMONG THROUGH HOLES AND VIAS
Document Type and Number:
Japanese Patent JP3158073
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for packaging an electronic device such as an integrated circuit using a ball grid array which does not need mutual connection among through holes or vias and to provide an apparatus for packaging an electronic device.
SOLUTION: An electronic device package 10 includes a substrate 12 having an opening 26. A single layer conductive circuit 18 is vacuum evaporated on a first surface 14 of the substrate 12. A thermal conductive element 28 is fixed on a second surface 16. An electronic device 30 is fixed on the thermal conductive element 28 so that it may be placed in the opening of the substrate 12. The electronic device 30 is electrically coupled to a wire bond pad 22 on the first surface 14 of the substrate 12.
Inventors:
James Warren Wilson
Application Number:
JP12703097A
Publication Date:
April 23, 2001
Filing Date:
May 16, 1997
Export Citation:
Assignee:
International Business Machines Corporation
International Classes:
H01L23/12; H01L21/48; H01L21/60; H01L23/14; H01L23/31; H01L23/498; (IPC1-7): H01L23/12; H01L21/60
Domestic Patent References:
| JP6224246A | ||||
| JP730226A |
Attorney, Agent or Firm:
Hiroshi Sakaguchi (1 person outside)