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Title:
SHORT TIME CURING AGENT AND ACCELERATOR FOR EPOXY RESIN
Document Type and Number:
Japanese Patent JPS6466172
Kind Code:
A
Abstract:

NEW MATERIAL: A new compd. is an imidazole compd. represented by the formula XmY (wherein X is the group represented by formula I; (m) is a value of 1 or more; R and R" are H, methyl or ethyl; (n) is 2-5; R' is methyl or ethyl; Y is an org. group having valence (m)).

EXAMPLE: 1-Aminopropyl2-ethyl-4methylimidazole or toluene-diisocyanate adduct represented by formula II.

USE: A one package hardener and accelerator for thermosetting epoxy resin system for curing epoxy resin with very high speed and at low curing temp. without no influence on storage stability of the mixture of epoxy resin and imidazole compd.

PREPARATION: The imidazole represented by formula III is allowed to react with the isocyanate represented by the formula Y(NCO)m to obtain the compd. represented by the formula XmY.


Inventors:
SHIYOUUCHIN RIN
PINNRIN KUO
Application Number:
JP19470688A
Publication Date:
March 13, 1989
Filing Date:
August 05, 1988
Export Citation:
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Assignee:
GRACE W R & CO
International Classes:
C07D521/00; C08G18/58; C07D233/61; C08G18/80; C08G59/40; C08G59/50; (IPC1-7): C07D233/61; C08G59/50
Attorney, Agent or Firm:
Heiyoshi Odashima