Title:
扁平物体の短時間熱処理方法と装置
Document Type and Number:
Japanese Patent JP2004536272
Kind Code:
A
Abstract:
The invention relates to a method and a device for the thermal treatment, especially short-term, of flat objects in particular, such as semi-conductor, glass or metal substrates. Heat is, at least in part, supplied to or taken away from both sides of said substrates by means of thermal conduction via a thermal conduction medium. The invention aims to improve the method and device so that they can be used effectively. To this end, a mixture consisting of two gases, differing greatly in their thermal conductivity, is used as a thermal conductive medium. The mixture on both sides of the substrate is individually adjusted so that the respective surface temperature is time-controlled by taking the respective heat exchange due to heat radiation into account.
Inventors:
Strauh, Gerd
Application Number:
JP2003504452A
Publication Date:
December 02, 2004
Filing Date:
May 25, 2002
Export Citation:
Assignee:
Ixtron, Age
International Classes:
B01F23/10; F27B5/14; F27B5/16; F27B5/18; F27D7/06; F28F13/02; H01L21/00; F27B5/04; H01L21/02; H01L21/324; (IPC1-7): F27B5/04; F27B5/14; F27B5/16; F27B5/18; F27D7/06; H01L21/02; H01L21/324
Attorney, Agent or Firm:
Takashiro Kojima