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Title:
SHOT MATERIAL PROJECTION DEVICE AND SHOT MATERIAL PROJECTION STATE DETECTION METHOD
Document Type and Number:
Japanese Patent JP2012016764
Kind Code:
A
Abstract:

To improve detection accuracy of the projection state of a shot material on a workpiece while securing a finish state of the workpiece.

The shot material projection device 10 includes a projection unit 16 which projects the shot material to the workpiece 12 so that the workpiece 12 is subjected to shot blast treatment or shot peening treatment, and an elastic wave detection sensor 26 directly installed on an axial end surface 34A of the workpiece 12. As the elastic wave detection sensor 26 is directly installed on the workpiece 12, an elastic wave generated on the workpiece 12 can be directly detected by the elastic wave detection sensor 26. Therefore, detection accuracy of the elastic wave, and therefore the detection accuracy of the projection state of the shot material 30 to the workpiece 12 can be improved. In addition, an installation part of the elastic wave detection sensor 26 on the workpiece 12 is the axial end surface 34A of the workpiece 12. Thereby, inhibition of projection of the shot material 30 by the elastic wave detection sensor 26 is prevented, and the finish state of the workpiece 12 is secured.


Inventors:
YAMAMOTO KAZUTOSHI
Application Number:
JP2010154235A
Publication Date:
January 26, 2012
Filing Date:
July 06, 2010
Export Citation:
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Assignee:
SINTOKOGIO LTD
International Classes:
B24C1/10
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda