To surely prevent increase of excessive currents at forward current flow and reverse currents which is caused by a pin hole formed on a Shottky electrode, relating to a Shottky barrier diode in which the Shottky electrode is provided on the surface of a silicon carbide epitaxial film grown from the surface of a silicon carbide single crystal substrate, on which a pad electrode is provided.
Between the Shottky electrode and the pad electrode, an intermediate metal film is provided in which the height of the Shottky barrier with the silicon carbide epitaxial film is equal to or higher than that of the shottky barrier with the Shottky electrode and the silicon carbide epitaxial film. So, the current through a pin hole is suppressed, even if the height of the Shottky barrier with the pad electrode and the silicon carbide epitaxial film is lower than that of the Shottky barrier with the Shottky electrode and the silicon carbide epitaxial film.
TSUCHIDA SHUICHI
MITSUYANAGI TOSHIYUKI
JPH11233796A | 1999-08-27 | |||
JP2001053293A | 2001-02-23 | |||
JP2001015771A | 2001-01-19 |
Koji Makimura
Toru Suzuki
Yoshiko Yamoto
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