Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3119475
Kind Code:
B2
Inventors:
Yasuhide Den
Application Number:
JP8992889A
Publication Date:
December 18, 2000
Filing Date:
April 10, 1989
Export Citation:
Assignee:
NEC
International Classes:
H01L21/31; C23C16/40; C23C16/44; H01L21/316; (IPC1-7): H01L21/31; C23C16/40; C23C16/44; H01L21/316
Domestic Patent References:
| JP61194838A | ||||
| JP150427A | ||||
| JP5621333A | ||||
| JP63244739A | ||||
| JP1278732A |
Other References:
伊藤隆司「（電子材料シリーズ）ＶＬＳＩの薄膜技術」丸善（昭６１−９−３０）Ｐ．６３
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)