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Patent Searching and Data


Title:
SHRINK FILM PACKAGE
Document Type and Number:
Japanese Patent JP2005082217
Kind Code:
A
Abstract:

To provide a shrink film package, from which a handle easy to grasp can be formed inexpensively and tiny pieces of debris, which are easy to scatter upon unsealing the package, are not produced.

According to the shrink film package, an article is packaged with a film 1, which is shrunk by heat to be stuck closely to the article to form the handle 2 on the top of the film 1. The handle 2 is formed by making a pair of incisions 3 curving inward on the film 1, making turn cuts 4 on both ends of each incision 3, and expanding the incisions 3 through the heat shrinking of the film 1. At the front ends of turn cuts 4, guide cuts 5 for unsealing are formed via connections, respectively. Meanwhile, stop cuts 6, which are separated from each other, are formed at the position where cleavages starting from respective guide cuts 5 would reach.


Inventors:
NISHIKAWA YOICHI
Application Number:
JP2003318470A
Publication Date:
March 31, 2005
Filing Date:
September 10, 2003
Export Citation:
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Assignee:
RENGO CO LTD
International Classes:
B65D71/08; B65D71/28; (IPC1-7): B65D71/08; B65D71/28
Attorney, Agent or Firm:
Bunji Kamada
Higashio Masahiro
Torii Kazuhisa