Title:
Shrink label mounting method and its mounting device
Document Type and Number:
Japanese Patent JP6307849
Kind Code:
B2
More Like This:
Inventors:
Yuichiro Kato
Application Number:
JP2013239593A
Publication Date:
April 11, 2018
Filing Date:
November 20, 2013
Export Citation:
Assignee:
Toyo Seikan Co., Ltd.
International Classes:
B65B53/02
Domestic Patent References:
| JP58149230A | ||||
| JP2006001573A | ||||
| JP8011840A |
Foreign References:
| US8235712 |
Attorney, Agent or Firm:
Heiwa International Patent Office