Title:
SHRINK PACKAGE DEVICE
Document Type and Number:
Japanese Patent JP2023173260
Kind Code:
A
Abstract:
To provide a shrink package device which can form a film easy break line by perforation on a shrink film of a shrink film package article without breaks on heating and in a form of facilitating taking-out of the article.SOLUTION: A perforation formation device 15 for providing a film easy break line 54 on one face of a shrink package article 50 of a hexagonal shape after shrink packaging includes a disc-formed round knife 16 equipped with a plurality of projection cutter blades 16a arranged circumferentially at intervals. This round knife 16 is provided with a plurality of projection cutter blades 16a in continuity only at a part in a circumferential direction, only in a virtual straight line 53 traversing one face of the shrink package article 50, so that a plurality of unit perforations 52a constituting a perforation 52 may be formed in continuity at 5 to 22 points at intervals S of 1.0 to 7.0 mm with a length of 0.5 to 1.5 mm.SELECTED DRAWING: Figure 1
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Inventors:
MIYAZAKI ATSURO
NISHIDA HIROYUKI
NISHIDA HIROYUKI
Application Number:
JP2022085391A
Publication Date:
December 07, 2023
Filing Date:
May 25, 2022
Export Citation:
Assignee:
FOURNET INC
International Classes:
B65B53/00; B65B61/02
Attorney, Agent or Firm:
Patent Attorney Showa International Patent Office