Title:
SHRINK PACKAGING METHOD, HEAT-SHRINKABLE FILM, AND PACKAGE
Document Type and Number:
Japanese Patent JP2017137110
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a shrink packaging method in which an object to be packaged can be easily shrink-packaged, and a package to be obtained has excellent opening quality, and a heat-shrinkable film suitable for the packaging method.SOLUTION: A shrink packaging method comprises: a process I of coating an object to be packaged 11 by a heat-shrinkable film to form a heat-shrinkable film coated body; and a process II of heating the heat-shrinkable film coated body and heat-shrinking the heat-shrinkable film to obtain a package. In the heat-shrinkable film, (1) an end part parallel with a TD direction of a heat-shrinkable film A12 and an end part parallel with the TD direction of a thermoplastic resin film B13 are formed in a joined state, (2) Elmendorf tear strength of a heat-shrinkable film A in the TD direction is different from Elmendorf tear strength of a thermoplastic resin film B in the TD direction, and (3) the length of the thermoplastic resin film B in the MD direction is shorter than the length of the heat-shrinkable film A in the MD direction.SELECTED DRAWING: Figure 3
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Inventors:
UCHIDA KAZUHO
Application Number:
JP2016020797A
Publication Date:
August 10, 2017
Filing Date:
February 05, 2016
Export Citation:
Assignee:
SEKISUI FILM KK
International Classes:
B65B53/00; B29C61/06; B65B53/02; B65D71/08
Domestic Patent References:
JPS6254912U | 1987-04-06 | |||
JP2011116033A | 2011-06-16 | |||
JPS62251329A | 1987-11-02 | |||
JP2008265777A | 2008-11-06 | |||
JPS59176074U | 1984-11-24 |
Attorney, Agent or Firm:
Patent Business Corporation Saegusa International Patent Office