To suppress the temperature increase of an equipment inexpensively and efficiently without using any special parts such as a thermoelectric converter and a radiation board.
A signal recording/reproducing device includes a multilayer substrate 62 where, for example, semiconductor integrated circuits 64 and 66 with a large power consumption are packaged, and the multilayer substrate 62 is stored in an armor case made of a main constitute of organic resin. Then, for example, the distance between the armor case and the multilayer substrate 62 and the packaging position of the semiconductor integrated circuits 64 and 66 with a large power consumption are carefully considered to prevent heat generated from the semiconductor integrated circuits 64 and 66 from greatly affecting the armor case.
JPH0637841 | [Name of device] Structure of information display window for camera |
JP3904902 | CAMERA |
JP2001159777 | IMAGE PICKUP DEVICE |
HIRATA HIDETOSHI
MIZUNO MASAHIKO
TAJIMA HIDEKAZU