Title:
信号伝送線路及び信号伝送線路の製造方法
Document Type and Number:
Japanese Patent JP7409493
Kind Code:
B2
Abstract:
A conductor non-formed portion where no conductor layer exists is provided in a first ground conductor layer. A multilayer body is provided with a void where no insulating resin exists. At least a portion of the conductor non-formed portion is provided in a first area positioned at a right of a first interlayer connection conductor with respect to a multilayer body left-right direction and at left of a second interlayer connection conductor with respect to the multilayer body left-right direction in a view in a multilayer body downward direction. At least a portion of a void overlaps with the conductor non-formed portion in the view in the multilayer body downward direction and is provided above a first signal conductor layer with respect to a multilayer body up-down direction and below the first ground conductor layer with respect to the multilayer body up-down direction.
Inventors:
Yuji Soeda
Application Number:
JP2022521774A
Publication Date:
January 09, 2024
Filing Date:
April 14, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K1/02; H01P3/08; H01P11/00; H05K3/00
Domestic Patent References:
| JP5741781B1 | ||||
| JP2016201370A | ||||
| JP53127170U | ||||
| JP2007201263A | ||||
| JP10098315A | ||||
| JP2016164882A |
Foreign References:
| WO2013094471A1 |
Attorney, Agent or Firm:
Patent Attorney Kaede International Patent Office
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