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Title:
SILANE-MODIFIED POLYAMIC ACID RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2007106836
Kind Code:
A
Abstract:

To provide a transparent polyimide-silica hybrid cured product or multilayered product with excellent adhesivity and insulating property.

This silane-modified polyamic acid resin composition comprises an alkoxy group-containing silane-modified polyamic acid obtained by reacting a polyamic acid(1) having a diamine residue with a benzoxazole skeleton and an epoxy group-containing alkoxysilane partial condensate(2) obtained by dealcoholization reaction of an epoxy compound(A) having one hydroxy group in a molecule with an alkoxysilane partial condensate(B), and a polar solvent. The silane-modified polyamic acid resin composition is made into a surface coating agent by coating, etc., to be multilayered on a film or substrate each with a specific coefficient of linear expansion.


Inventors:
WAKUI HIROYUKI
YOSHIDA TAKESHI
MATSUOKA TAKESHI
OKUYAMA TETSUO
MAEDA SATOSHI
Application Number:
JP2005297851A
Publication Date:
April 26, 2007
Filing Date:
October 12, 2005
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
C08L79/08; C09D177/00; C09D183/10; C08G73/10
Domestic Patent References:
JP2002293933A2002-10-09
JP2004059697A2004-02-26
JP2003200527A2003-07-15
JP2005132904A2005-05-26
JPH11505184A1999-05-18