To provide a thermosetting silicone resin composition for optical semiconductor sealing use having excellent heat resistance and thin film curability.
A silanol condensation catalyst contains at least an organohafnium compound represented by formula (1) and/or formula (2) in (C). The thermosetting silicone resin composition for optical semiconductor sealing use contains: (A) 100 pts.mass of an organopolysiloxane having two or more silanol groups per molecule; (B) 0.1-2000 pts.mass of a silane compound having two or more alkoxy groups per molecule; and (C) the organohafnium compound. A sealing body using the thermosetting silicone resin composition is also provided. In the formula (1), n is an integer of 1-4, R1 is a hydrocarbon group, and R2 is a 1-18C alkyl group. In the formula (2), m is an integer of 1-4, R2 is a 1-18C alkyl group, and R3 and R4 are each a 1-18C hydrocarbon group or alkoxy group and are the same as or different from each other.
ISHIKAWA KAZUNORI
SAIKI TAKEAKI
| JP2011137140A | 2011-07-14 | |||
| JP2012021131A | 2012-02-02 | |||
| JP2006206700A | 2006-08-10 | |||
| JP2009105432A | 2009-05-14 | |||
| JP2011137140A | 2011-07-14 | |||
| JP2012021131A | 2012-02-02 | |||
| JP2006206700A | 2006-08-10 |
| WO2010071092A1 | 2010-06-24 | |||
| WO2010071092A1 | 2010-06-24 |
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi