To provide a silicon-aluminum composite metal particularly having high Young's modulus and low linear thermal expansion coefficient and being machinable as is the case with a metal and also to provide its plated body and further to impart uniform smoothness equal to that of a plated surface of a plated metal to the above plated body having a plated machined surface.
The silicon-aluminum composite metal is constituted of silicon and aluminum or an aluminum alloy and has ≥100 GPa Young's modulus and ≤10×10-6/°C linear thermal expansion coefficient at a temperature between room temperature and 400°C. Further, the silicon-aluminum composite metal is obtained by infiltrating, under no pressure, molten aluminum or an aluminum alloy into a filled body or molded body of 50 to 70% volume filling ratio of silicon powder at 700 to 1,000°C in a nitrogen atmosphere containing magnesium vapor.
SATO TATSUZO
ODANO CHOKUSUI
SHIMOJIMA HIROMASA
CELANX KK
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