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Title:
誘導自己集合体施与のためのケイ素含有ブロックコポリマー
Document Type and Number:
Japanese Patent JP6782695
Kind Code:
B2
Abstract:
The invention also relates to a novel composition comprising the novel polymer and a solvent. The invention further relates to a process utilizing the novel composition for affecting directed self-assembly of the block copolymer.

Inventors:
Wu Hempen
In jean
Lin Gwang Yang
Kim Ji Eun
Ponesh Margaretta
Application Number:
JP2017523324A
Publication Date:
November 11, 2020
Filing Date:
October 28, 2015
Export Citation:
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Assignee:
Merck Patent Gesellschaft mit beschraenkter Haftung
International Classes:
C08L53/00; B05D7/24; C08F8/42; C08F297/02; G03F7/40; H01L21/027
Domestic Patent References:
JP2500152A
JP2000221686A
JP2001166486A
JP2001253885A
JP2013171090A
JP2014152332A
JP2014174428A
Other References:
Sooriyakumaran, Ratnam et al.,Positive Bilayer Resists for 248 and 193 nm Lithography,Proceedings of SPIE,1998年,3333,219-227
Attorney, Agent or Firm:
Mitsufumi Esaki
Blacksmith
Katsunori Uenishi
Ichiro Torayama