Title:
SILICON LAYER FORMING APPARATUS
Document Type and Number:
Japanese Patent JPH0590395
Kind Code:
A
Abstract:
PURPOSE: To prolong a life of an atomizer and to reduce a manufacturing cost by eliminating necessity of directly heating the atomizer by providing the atomizer for atomizing solution containing powder silicon and solvent in a foggy state and a heater for heating the solution atomized from the atomizer.
CONSTITUTION: An atomizer 12 for atomizing solution (e.g. solution made of powder silicon and solvent) 20 in a foggy state in a direction of a rotary table 11 above the table 11 for placing a semiconductor substrate 21. A first heater 14 is provided at the side of a passage in the solution 20 to be atomized in a foggy state by the atomizer 12. Further, a second heater 15 is provided on the side of the table 11.
Inventors:
MIZUIDE HISASHI
Application Number:
JP27701491A
Publication Date:
April 09, 1993
Filing Date:
September 26, 1991
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
B05C11/08; B05D1/40; C01B33/02; C23C14/32; H01L21/76; H01L21/762; (IPC1-7): B05C11/08; B05D1/40; C01B33/02; C23C14/32; H01L21/76
Attorney, Agent or Firm:
Funabashi Kuninori
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