Title:
シリコン材料の切断補助装置、切断方法、切断システム
Document Type and Number:
Japanese Patent JPWO2017002670
Kind Code:
A1
Abstract:
シリコン材料の切断補助装置は、シリコン材料の切断に際し微細気泡を含むｐＨが１０以上の無機アルカリ電解水を切削液として該シリコン材料の被切断部に供給する。シリコン材料の切断システムは、シリコン材料を切断する切断装置と、微細気泡を含むｐＨが１０以上の無機アルカリ電解水を切削液として該シリコン材料の被切断部に供給する切断補助装置と、を備える。
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Inventors:
Yasuaki Nishio
Application Number:
JP2017526299A
Publication Date:
July 19, 2018
Filing Date:
June 21, 2016
Export Citation:
Assignee:
Yasuaki Nishio
Masayoshi Minami
Toshikazu Takenouchi
Hideki Sato
Masayoshi Minami
Toshikazu Takenouchi
Hideki Sato
International Classes:
H01L21/304; B24B27/06; B24B55/02; B28D5/04; B28D7/02; C10M125/10; C10M125/18; C10M125/20; C10M125/22; C10M173/02
Domestic Patent References:
| JP2010172993A | 2010-08-12 | |||
| JP2013111713A | 2013-06-10 | |||
| JP2013052493A | 2013-03-21 | |||
| JP2015098079A | 2015-05-28 | |||
| JPH02262955A | 1990-10-25 | |||
| JP2003068677A | 2003-03-07 | |||
| JP2013248582A | 2013-12-12 | |||
| JP2009107050A | 2009-05-21 | |||
| JP2012092205A | 2012-05-17 | |||
| JP2005088394A | 2005-04-07 |
Attorney, Agent or Firm:
Morioka Masayuki
Sansui International Patent Office
Sansui International Patent Office
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