Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SILICON NANO-NEEDLE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2011230253
Kind Code:
A
Abstract:

To provide a needle having a high degree of design freedom, a high bending strength, and an extremely high aspect ratio.

A method of manufacturing a silicon nano-needle includes: a step of forming a lead protection film R1, which is a film for protecting a continuous region having a minimum width of 1 μm or more, in one or more areas of a principal surface 101 of a silicon substrate 100; a step of forming a straight cylindrical body 102 by etching a region exposed from the lead protection film R1 on the principle surface 101 of the silicon substrate 100 in a vertical direction; a step of thermally oxidizing the silicon substrate 100 until the maximum cross-sectional width of a right cylindrical body region 104 remaining unoxidized in the right cylindrical body 102 becomes less than 1 μm; and a step of forming a needle 10 made of silicon and having a lead, which is composed of the right cylindrical body region 104, and a mount 105, which has a side surface composed of a flare surface spreading toward the bottom and from the top of which the lead 104 protrudes, by removing an oxidized film 103 formed on the silicon substrate 100.


Inventors:
NAKAMURA JUN
MAENAKA KAZUSUKE
Application Number:
JP2010103922A
Publication Date:
November 17, 2011
Filing Date:
April 28, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
YAMAHA CORP
HYOGO PREFECTURE
JAPAN SCIENCE & TECH AGENCY
International Classes:
B81B1/00; B81C1/00; G01Q70/16; H01J1/304; H01J9/02
Domestic Patent References:
JPH05226317A1993-09-03
JP2004538106A2004-12-24
JP2009254814A2009-11-05
JP2008143068A2008-06-26
JPH11304824A1999-11-05
Attorney, Agent or Firm:
knowledge partners Patent business corporation
Dai Yoshida
Wataru Iwakami
Dai Yoshida
Wataru Iwakami