Title:
シリコンウェーハの研磨方法及び研磨装置
Document Type and Number:
Japanese Patent JP5716612
Kind Code:
B2
Inventors:
Shigeru Ohba
Application Number:
JP2011190951A
Publication Date:
May 13, 2015
Filing Date:
September 01, 2011
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L21/304; B24B37/07; B24B49/18; B24B57/02
Domestic Patent References:
| JP2002141319A | ||||
| JP2001129754A | ||||
| JP2008047849A | ||||
| JP2011077525A | ||||
| JP4297614B2 |
Attorney, Agent or Firm:
Mikio Yoshimiya