Title:
シリコンウェーハの加工方法
Document Type and Number:
Japanese Patent JP5120335
Kind Code:
B2
Inventors:
Okabe Hidemitsu
Application Number:
JP2009123620A
Publication Date:
January 16, 2013
Filing Date:
May 21, 2009
Export Citation:
Assignee:
Sumco inc.
International Classes:
C30B33/12; C30B29/06; C30B33/10; H01L21/02; H01L21/306; H01L21/3065; H01L27/12
Domestic Patent References:
| JP2007142229A | ||||
| JP2007096323A | ||||
| JP2008109014A | ||||
| JP2002057108A |
Foreign References:
| WO2005057640A1 | ||||
| WO2005001916A1 |
Attorney, Agent or Firm:
Hirotsugu Yoshioka