To obtain a silicone adhesive composition for an optical semiconductor providing a cured product having an excellent reflectivity and to provide an optical semiconductor device having high reliability using the same.

The silicone adhesive composition for an optical semiconductor comprises (A) 100 pts.wt. of a polyorganosiloxane containing an alkenyl group bonded to two or more silicon atoms in one molecule and having the alkenyl group content of 30-600 mmol/100 g, (B) a polyorganohydrogensiloxane containing three or more SiH groups in one monomer in an amount to give 1.0-5.0 SiH groups based on one silicon atom bonded alkenyl group of the component (A), (C) a catalytic amount of a platinum-based catalyst, (D) 0.3-20 pts.wt. of an adhesion imparter and (E) 60-150 pts.wt. of titanium oxide having an average particle diameter of 0.1-0.5 μm.

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