To provide a silicone composition for preparing a silicone adhesive having an excellent electroconductivity, in particular.
The prepared composition comprises: an organopolysiloxane including, on the average per molecule, at least two silicon-bonded alkenyl groups; an organohydrodiene polysiloxane including, on the average per molecule, at least two silicon-bonded hydrogen atoms at a concentration sufficient for curing the provided composition; an electroconductive filler at a quantitative ratio sufficient for conferring electroconductivity onto the silicone adhesive (the filler includes particles having outer surfaces constituted by a metal selected from the group consisting of silver, gold, platinum, palladium, and their alloys); an effective quantity of a hydroxy-functional organic compound having an upper limit molecular weight of 1000 and including at least one hydroxyl group per molecule, assuming that the compound in question includes no acetylenic hydroxyl groups and that the compound in question does not substantially hinder the curing of the composition; and a catalytic quantitative ratio of a hydrosilylation catalyst.
LUTZ MICHAEL ANDREW
| JPH11181289A | 1999-07-06 | |||
| JPH0493359A | 1992-03-26 |
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
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