Title:
SILICONE COMPOSITION FOR TRANSFER ADHESION
Document Type and Number:
Japanese Patent JPS56155257
Kind Code:
A
Abstract:
A coating composition for rendering a material non-adherent to normally adherent high-phenyl content pressure sensitive adhesives comprising (i) 100 parts by weight of a silicon composition comprising (a) 100 parts by weight of a vinyl chain- stopped diorganopolysiloxane base from 50 to 100,000 centipose at 25 DEG C; (b) 0.1 to 10 parts by weight of a trimethyl chain-stopped polymethylhydrogen siloxane fluid cross-linking agent having from 10% to 100% by weight SiH groups and having a viscosity in the range of 25 to 1000 centipose at 25 DEG C; (c) an effective amount of platinum catalyst for facilitating a heat cure hydrolisation reaction, and (ii) 2.0 to 10 parts by weight of silicone resin. The composition can be applied to a base element of metal, foil, glass, plastic paper or fibrous materials.
Inventors:
DEUAN FURANKURIN MERIRU
Application Number:
JP4181181A
Publication Date:
December 01, 1981
Filing Date:
March 24, 1981
Export Citation:
Assignee:
GEN ELECTRIC
International Classes:
C08L83/00; C08L83/04; C08L83/07; C09D5/20; C09D183/04; C09J5/00; C09J7/02; (IPC1-7): C08L83/04; C09D3/82; C09D5/20; C09J5/00; C09J7/02; C09J7/04