Title:
Silicone constituent
Document Type and Number:
Japanese Patent JP6047351
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a silicone composition that has excellent long-term heat resistance at high temperature.SOLUTION: The silicone composition includes: a silicon alkoxide-modified polydimethylsiloxane in which an end hydroxyl group of a polydimethylsiloxane is modified with a silicon alkoxide; and an (ethyl acetoacetate-modified titanium alkoxide)-modified polydimethylsiloxane in which an end hydroxyl group of a polydimethylsiloxane is modified with a titanium alkoxide that has been stabilized with ethyl acetoacetate, and that has an alkoxy group with four or more carbon atoms. The silicone composition undergoes little weight loss and no flexibility loss even when maintained at high temperature, and thus can be used in environments in which the composition is continuously exposed to high temperature. Since the silicone composition has adequate viscosity, the composition can be used as a base resin for conversion into a paste, and can be applied to screen printing by conversion into a paste blended with a filler if necessary. The silicone composition has improved handleability because of its excellent storage stability at ordinary temperature.
Inventors:
Yusuke Aoki
Ken Yoshioka
Ken Yoshioka
Application Number:
JP2012203579A
Publication Date:
December 21, 2016
Filing Date:
September 14, 2012
Export Citation:
Assignee:
Mie University
koa corporation
koa corporation
International Classes:
C08G77/18; C08L85/00; C08G77/398; C08G77/58; C08L83/06
Domestic Patent References:
| JP10095852A | ||||
| JP2006273953A | ||||
| JP8151552A |
Foreign References:
| WO2010143357A1 |
Attorney, Agent or Firm:
Patent Business Corporation Takewa International Patent Office