Title:
SILICONE GREASE COMPOSITION FOR HEAT DISSIPATION, AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2000109373
Kind Code:
A
Abstract:
To provide a high performance silicone grease composition for heat dissipation having high heat conductivity and free from scratching the silicone surface, and to provide a semiconductor device excellent in heat dissipation efficiency using the composition.
This silicone grease composition is prepared by blending (A) 50-95 wt.% aluminum nitride powder having 0.5-10 μm average particle diameter and containing no particles having ≥100 μm particle diameter, (B) 5-50 wt.% liquid silicone having viscosity of 50-500,000 cs at 25°C and (C) 0-30 wt.% powder of at least one kind selected from zinc oxide, alumina, boron nitride and silicone carbide.
Inventors:
YAMADA KUNIHIRO
ISOBE KENICHI
TAKAHASHI TAKAYUKI
ISOBE KENICHI
TAKAHASHI TAKAYUKI
Application Number:
JP28119698A
Publication Date:
April 18, 2000
Filing Date:
October 02, 1998
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
H01L23/36; C04B37/00; C08L83/04; H01L23/373; (IPC1-7): C04B37/00; H01L23/36
Domestic Patent References:
| JPH10110179A | 1998-04-28 | |||
| JPH07252377A | 1995-10-03 | |||
| JPH06209057A | 1994-07-26 |
Attorney, Agent or Firm:
Kiyoaki Takita
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