Title:
SILICONE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2022086063
Kind Code:
A
Abstract:
To provide a silicone resin composition which is usable at about 200°C that is a temperature during operation of a light-emitting diode element, and can exhibit high transparency at such a using temperature.SOLUTION: A silicone resin composition is composed of a methyl-based silicone resin, and an inorganic filler that contains 90 vol.% or more of magnesium fluoride and has a volume average particle diameter of 1-20 μm.SELECTED DRAWING: None
Inventors:
IKEDA YUICHI
FUKUDA KENTARO
FUJII AYAKO
FUKUDA KENTARO
FUJII AYAKO
Application Number:
JP2020197868A
Publication Date:
June 09, 2022
Filing Date:
November 30, 2020
Export Citation:
Assignee:
TOKUYAMA CORP
International Classes:
C08L83/04; C08K3/013; C08K3/16