Title:
SILICONE RUBBER COMPOSITION FOR EXTRUSION MOLDING
Document Type and Number:
Japanese Patent JP3198835
Kind Code:
B2
Abstract:
PURPOSE: To obtain a composition containing an organopolysiloxane, fine powder silica, an organopolysiloxane copolymer and an organic peroxide at a specific ratio and capable of providing a silicone rubber having high hardness, high modulus and high strength.
CONSTITUTION: This composition contains (A) 100 pts.wt. of an organopolysiloxane expressed by the formula R1nSiO(4-n)/2 [R1 is a monovalent hydrocarbon; (n) is 1.98-2.02], having ≥2000 average polymerization degree, (B) 10-100 pts.wt. of fine powder silica having ≥100m2/g specific surface area, (C) 5-50 pts.wt. of an organopolysiloxane copolymer containing a triorganosiloxy unit of the formula R23SiO1/2 [R2 is vinyl, phenyl, a 1-8C alkyl, etc.] and SiO2 unit as main component units and having (0.6:1) to (1.2:1) molar ratio of R23SiO1/2 unit to SiO2 unit and (D) 0.1-10 pts.wt. of an organic peroxide of formula I {X is (CH2)n [(n) is 2-8], formula II, etc.; R3 and R4 are each a 3-10C monovalent hydrocarbon or silyl}, and 100% modulus of a silicone rubber obtained by carrying out extrusion molding of the composition is ≥40kgf/cm2.
Inventors:
Masachika Yoshino
Susumu Sekiguchi
Susumu Sekiguchi
Application Number:
JP29881294A
Publication Date:
August 13, 2001
Filing Date:
November 08, 1994
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
B29C47/00; C08K3/36; C08K5/14; C08L83/04; (IPC1-7): C08L83/04; B29C47/00; C08K3/36; C08K5/14
Domestic Patent References:
| JP6306296A | ||||
| JP2124977A | ||||
| JP6424858A | ||||
| JP6157908A |
Attorney, Agent or Firm:
Takashi Kojima