Title:
SILVER COATED COPPER ALLOY POWDER AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2016145422
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a silver coated copper alloy powder low in specific volume resistance and excellent in storage stability (credibility) and a manufacturing method therefor.SOLUTION: A copper alloy powder having a composition containing at least one of nickel and zinc of 1 to 50 mass% and the balance copper with inevitable impurities (preferably a copper alloy powder having cumulative 50% particle diameter (Ddiameter) measured with a laser diffraction type particle size distribution device of 0.1 to 15 μm) is coated by a silver-containing layer of 7 to 50 mass%, preferably a layer consisting of silver or a silver compound.SELECTED DRAWING: Figure 1B
Inventors:
INOUE KENICHI
OGI KOZO
EBARA ATSUSHI
HIYAMA YUTO
YAMADA TAKEHIRO
KAMIYAMA TOSHIHIKO
OGI KOZO
EBARA ATSUSHI
HIYAMA YUTO
YAMADA TAKEHIRO
KAMIYAMA TOSHIHIKO
Application Number:
JP2016049206A
Publication Date:
August 12, 2016
Filing Date:
March 14, 2016
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO
International Classes:
B22F1/05; B22F1/107; B22F1/17; B22F9/00; C22C18/00; C22C18/02; C22C19/03; C22C30/02; C22C30/06; H01B1/00; H01B1/22; H01B5/00
Domestic Patent References:
| JPH0378906A | 1991-04-04 | |||
| JP2003068139A | 2003-03-07 | |||
| JPH10152630A | 1998-06-09 | |||
| JP2010077501A | 2010-04-08 | |||
| JP2014091842A | 2014-05-19 | |||
| JP2012180564A | 2012-09-20 | |||
| JP2011028985A | 2011-02-10 | |||
| JPH08311304A | 1996-11-26 | |||
| JP2002332501A | 2002-11-22 | |||
| JP2012142127A | 2012-07-26 |
Attorney, Agent or Firm:
Koichi Okawa
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